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2 in 1 Head Touch Screen BGA Rework Station

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2023-10-11 08:34

  • Browse the number:

    434

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Company Profile

Shenzhen Dinghua Innovation Automation Co.,Ltd

By certification [File Integrity]

Contact：dinghua(Mr.)  

Email：

Telephone：

Phone：

Area：Beijing

Address：Beijing

Website：http://www.dhsinobga.com/ http://dinghua.lf-changda.com/

Product Details


                                                        2 in 1 head Touch Screen BGA Rework Station

1. Product description of 2 in 1 head BGA rework station DH-A1L

Dinghua BGA Rework Station  DH-A1L

This machine is for repairing motherboard IC/Chip/Chipset of laptops, Mobile, PC, iPhones, Xbox, etc. With 

features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Laser  Position, 

Soldering  Iron, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.

2. Product specification of 2 in 1 head bga rework station DH-A1L

 

DH-A1L  Specification

Product name

soldering and desoldering machine

Power

4900W

Top heater

Hot air 800W

Bottom heater

Hot air 1200W, Infrared 2800W

Iron heater

90w

Power supply

AC220V±10% 50/60Hz

Dimension

640*730*580mm

Positioning

V-groove, PCB support can be adjusted in any direction   with an external universal fixture

Temperature control

K-type thermocouple, closed-loop control, independent   heating

Temp accuracy

±2 degrees

PCB size

Max 500*400 mm Min 22*22 mm

BGA chip

2*2-80*80mm

Minimum chip spacing

0.15mm

External Temperature Sensor

1(optional)

Net weight

45kg

 

3. Product advantages of  2 in 1 head bga rework station DH-A1L

 

4. Product details of 2 in 1 head bga rework station DH-A1L

 

 

5. Why Choose 2 in 1 head BGA rework station DH-A1L

â‘ Precise PID smart temp control, the No.1 key factor for the quality of the BGA Rework Station Temperature curve.

â‘¡Accurate rework only heats the chips where needed. All excess heat will reflow back to ensure the components

 around BGA will not be influenced.

â‘¢Heating doesn't influence the appearance of PCB even after using it several times.


6. Packing, and delivery  of 2 in 1 head bga rework station DH-A1L

        


7. Know something about BGA 

Light BGA package material

Optical BGA packaged shells are often made of ceramic materials. This rugged ceramic material has many advantages, such as 

design flexibility with micro design rules, simple process technology, high performance, and high reliability, generally by changing 

the physics of the shell The structure can be designed for optical BGA packages.

Ceramic materials also have airtightness and good primary reliability. This is due to the fact that the thermal diffusion coefficient 

of the ceramic material is very similar to the thermal diffusion coefficient of the GaAs device material. Moreover, since the ceramic 

material can be three-dimensionally wired with overlapping channels, the overall package size will be reduced.

In general, heat can be controlled when mounting optical devices because heat can deform the package. The final alignment of the optical 

device with the optical fiber can also produce movement that will change the optical characteristics. With ceramic materials, thermal 

deformation is small. Therefore, ceramic materials are very suitable for optoelectronic component packaging and have a significant 

impact on the optical communications transmission network market.


http://www.dhsinobgas.com/